UTL has state of art facilities for manufacturing its telecom products. With the expertise developed over the years, UTL is in a strong position to take up electronic manufacturing of sub assemblies and full assemblies for the customers to meet their specifications.
UTL Provides complete turnkey solution from Concept - Product - Rollout.
|
Services - Manufacturing Facilities
- SMD
- Auto insertion
- Assembly
- Testing
- Integration
- 25000 Sqft Space for Manufacturing
|
 |
SMD Equipments
- Screen printer EKRA E4
- Fuji glue dispenser GL2
- Fuji chip mounter CP643E
- Fuji fine chip placer IP3E
- AOI Photondynamics 7550
- Reflow oven BTU Paragon 150
- Wave soldering Seho
|
 |
SMD Capabilities
- Chip shooters – 0.09 sec / component, 0603 (0201 ) to 20*20 mm
- Fine chip placer - 0.55 sec / component, 1005 (0402) to 74*74 mm, including TAB, GQFP, BGA. Placing precision 0.025mm
- Glue dispenser – gluing accuracy 0.15mm
- Screen Printing – Printing accuracy 0.025 mm
- Oven - 10 heating zone, 2 cooling zone, nitrogen compatible
|
Auto Insertion Capabilities
-
Capable to insert jumper wire & axial components from 5mm to 26mm pitchTact speed of 0.4 sec to 0.6 sec per component.
-
Component taping width of 26 mm, 52 mm, jumper reel.
|
Testing Equipments
- Bare board tester
- Genrod ICT
- EPROM Programmer
- Simulators & jigs
- Network analyzer
- ADSL & DSL Testers
- Optical spectrum analyser
- PCM tester
- Environmental test Chamber (Dust, Dry solder, salt, humidity, dry heat, humidity)
|
 |
